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  • reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7902660May 24, 2006Mar 8, 2011Amkor Technology, Inc.Substrate for semiconductor device and manufacturing method thereofUS7915077Jul 28, 2008Mar 29, 2011Micron Technology, Inc.Methods of making metal core foldover package structuresUS7932595Mar 19, 2010Apr 26, 2011Amkor Technology, Inc.Electronic compo
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