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  • r 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7932165Nov 27, 2006Apr 26, 2011Bridge Semiconductor CorporationMethod of making a semiconductor chip assembly with a laterally
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