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  • Examples of typical resinous adhesives useful in this invention include thermosetting resins, such as phenolic resins, aminoplast resins having pendant ??,??-unsaturated carbonyl groups, urethane resins, epoxy resins, ethylenically-unsaturated resins, acrylated isocyanurate resins, urea-formaldehyde resins, isocyanurate resins, acrylated urethane resins, acrylated epoxy resins, bismaleimide resins
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