he same process as in qualcomm and ST-E case it vastly improves power effiecency, a big problem with currant 4g.2) As most of the components are included on die that you have mentioned, that means more space out side of the die, less hastle for the manufacturers and more space inside the device/phone for things like battery/or smaller device.Regards to Apple, apple bought PA semi, back in 2007/08