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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • The adhesive member that is more flexible than the insulating tape material is provided to cover to the region including the lands located outside the edge of the semiconductor chip, so that the distortion caused at the external terminals due to the linear expansion coefficient difference between the semiconductor device and the printed wiring board can be alleviated by the deformation of the flex
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