About: isa:302378369   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • The present invention is particularly concerned with highly thermally conductive and electrically insulating substrates with improved chip-to-substrate and substrate-to-card interconnection reliability by employing ceramic-filled polymers and polymer-filled ceramics for the packaging substrate with low dielectric constant and a coefficient of thermal expansion (CTE) close to that of the silicon de
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software