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  • hin film is formed through chemical exchange or reaction with a second reactantUS200200488808 Ago 200125 Abr 2002Joo-Won LeeMethod of manufacturing a semiconductor device including metal contact and capacitorUS200200520973 May 20012 May 2002Park Young-HoonApparatus and method for depositing thin film on wafer using atomic layer depositionUS2002005523529 Oct 20019 May 2002Micron Technology, Inc.,Me
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