This is accomplished by integrating the process of forming a copper seed layer in an interconnect structure such as a trench or a groove, with the process of plasma cleaning of the...http://www.google.es/patents/US6395642?utm_source=gb-gplus-sharePatente US6395642 - Semiconductor substrate B???squeda avanzada de patentes N???mero de publicaci???nUS6395642 B1Tipo de publicaci???nConcesi???n N???mer