The average combined thickness of the conductive tape 191 and copper foil 193 used in the preferred embodiment of the invention (the 3M 9703 Transfer Conductive Adhesive mentioned above) is approximately 1.4 thousands of an inch; the semiconductor LED die chip 192, a product marketed by Hewlett-Packard, National Semiconductor, and other companies, is less than five thousands of an inch thick, depe