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  • The conductive material such as copper (Cu), nickel (Ni), aluminum (Al), rhodium (Rh), palladium (Pd), tungsten (W) or other metal, nickel-cobalt (NiCo) or other alloy combinations thereof is deposited (electroplated) in the pattern ???A??? of the photoresist layer 48 to form the contactor 30 as shown in FIG. 11G. Preferably, a contact material which is different from that of the conductive layer
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