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  • The interposer may also include conductive traces carried by the substrate...http://www.google.com/patents/US7902648?utm_source=gb-gplus-sharePatent US7902648 - Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsAdvanced Patent SearchPublication numberUS7902648 B2Publication typeGrantApplication numberUS 11/398,912Publication da
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