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  • The materials which can be used as reactive adhesive (A) of this invention include synthetic resins such as epoxy resin, urea resin, melamine resin, guanamine resin, phenolic resin, xylene resin, furan resin, diallyl phthalate resin, bis-maleimide resin, triazine resin, polyester resin, polyurethane resin, polyvinyl butyral resin, phenoxy resin, polyamide resin, polyimide resin, cyanoacrylate resi
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