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  • The openings 38, being subsequently cleared of debris and contaminants by plasma etching, chemical etching, ultrasonic cleaning or other methods known to the art, are then filled with solder 30 by plating or solder paste filling, as shown in U.S. Pat. No. 5,587,342 and European Patent Application 94203167.5, solder jetting, or solder injection molding, as shown in U.S. Pat. No. 5,244,143 which are
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