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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • The pressure-sensitive adhesive composition or tape of the invention is used in securing electric or electronic parts made of metals, especially copper or copper alloy when etching, plating or soldering treatment is carried out thereon, and as a masking tape to lead frames when semiconductor chips are secured, bonded, wire bonded or resin encapsulated during the manufacture of semiconductor device
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