The airflow can be provided, for example, with a fan or other device positioned within the electronic assembly 100 or within the thermal dissipation device 120A, 120B. The airflow is directed in a pathway that is parallel to the PCBs 102 and 104 and power systems 130A, 130B. A primary airflow can thus be directed at, above, or below the PCB 104, the heat-generating components 110, the power system