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  • That is, there is a trade-off relation between the thermal expansion coefficient of the underfill resin 240 and the viscosity thereof, in which filler such as silica or alumina only needs to be mixed by a large amount in order to reduce the thermal expansion coefficient, but a larger amount of the mixed filler causes a higher viscosity. [0015] Japanese Patent Laid-Open Publication No. 2000-260820
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