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  • hnology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7977159 *Mar 8, 2006Jul 12, 2011Kabushiki Kaisha ToshibaMemory chip and semiconductor device using the memory chip and manufacturing method of tho
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