prov:value
| - In one embodiment, sputtering plate 20 is comprised of at least one of aluminum and aluminum alloys, molybdenum and molybdenum alloys, copper and copper alloys, tungsten, titanium or tantalum, or any other non-magnetic metallic and non-metallic materials and alloys including carbon, carbides, silicon, silicides, germanium, germanium alloys, conductive oxides, and conductive oxide compositions.
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