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  • The conductor patterns 118 are coated, except for the inner leads 120, with an insulating resin film 124 formed of an insulating resin such as silicone resin, and a metal layer 130 is provided on the surface of the resin film 124 in the peripheral area of the device hole, in which the semiconductor element 112 is carried, by a metallic foil such as copper or by a plating.
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