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| - lating package with sealantUS6124151Nov 18, 1998Sep 26, 2000Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS6175149Feb 13, 1998Jan 16, 2001Micron Technology, Inc.Mounting multiple semiconductor dies in a packageUS6175162Sep 8, 1999Jan 16, 2001National Semiconductor CorporationSemiconductor wafer having a bottom surface prot
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