lies, packages including the same, and methodsUS791507728 Jul 200829 Mar 2011Micron Technology, Inc.Methods of making metal core foldover package structuresUS791571817 May 200229 Mar 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS79198041 Dic 20065 Abr 2011Oracle America, Inc.Power distribution for high-speed integrated circuitsUS7998065 *18 Jun 200216 A