prov:value
| - Further, with the increase of the package size (z), the warp of the package becomes small. [0173] Further, as materials of the resin layer, thermosetting resin such as silicone resin, vinyl polymerization resin, phenolic resin, unsaturated polyester resin, diallyl phthalate resin, cyanate ester and acrylic resin can be employed. [0174] Further, as materials if resin layer, and also an insulator of
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