ual to that of a Czochralski(hereinafter abbreviated as CZ) silicon mirror-finished wafer.Heretofore, as a semiconductor wafer on which a semiconductor device such as IC, LSI or the like is fabricated, a CZ silicon mirror-finished wafer has generally been used, which is obtained by a procedure in which a wafer is cut from a siliconsingle crystal which has been grown by being pulled from a silicon