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  • Representative pairs of materials that can be used to form a bi-material element include, but are not limited to, a low thermal-expansion material, such as silicon oxide whose composition can be expressed as SiOx (having a thermal-expansion coefficient ???tec??? of about 0.5 ppm/K), silicon nitride whose composition can be expressed as SiNx (tec ???1 ppm/K), and silicon carbide whose composition c
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