About: isa:361890371   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • That is, even if numbers and types of semiconductor chips and electric parts mounted on the interposer of the semiconductor device increase, because of usage of a thermoplastic resin as the IC cover 10M, the space for accommodating the above items is substantially formed due to the thermal deformation of the IC cover 10M.
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software