Similarly, as shown in FIG. 2, a typical process 20 for manufacturing so-called ???flip-chip??? and ???Chip-On-Board??? (COB) Multi-Chip Modules (MCMs), in which multiple IC dice are typically attached directly to a substrate, such as a printed circuit board (PCB), begins with ICs being fabricated on a surface of a semiconductor wafer 22 in the same manner as described above.