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  • a substrate such as a chip, board, module or another integrated...http://www.google.com/patents/US5818107?utm_source=gb-gplus-sharePatent US5818107 - Chip stacking by edge metallizationAdvanced Patent SearchPublication numberUS5818107 APublication typeGrantApplication numberUS 08/785,187Publication dateOct 6, 1998Filing dateJan 17, 1997Priority dateJan 17, 1997Fee statusPaidPublication number0878
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