as epoxyacrylate, epoxy, and polyimide. [0088] The second cover layer can be made up of a highly insulating resin based on a resin such as polymethyl methacrylate, polyacrylate, or polymethyl isopropenyl ketone. [0089] The bump formation method provided by the fifth aspect of the present invention is a method for forming bumps on a substrate provided with a plurality of electrode pads, comprising