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  • as epoxyacrylate, epoxy, and polyimide. [0088] The second cover layer can be made up of a highly insulating resin based on a resin such as polymethyl methacrylate, polyacrylate, or polymethyl isopropenyl ketone. [0089] The bump formation method provided by the fifth aspect of the present invention is a method for forming bumps on a substrate provided with a plurality of electrode pads, comprising
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