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  • gies AgMethod for making a device including placing a semiconductor chip on a substrateUS7795741 *Sep 7, 2007Sep 14, 2010Renesas Technology Corp.Semiconductor deviceUS7829986Apr 1, 2006Nov 9, 2010Stats Chippac Ltd.Integrated circuit package system with net spacerUS7846768Jul 22, 2008Dec 7, 2010Micron Technology, Inc.Stacked die package for peripheral and center device pad layout deviceUS7868470Jul
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