IC die 102 is any type of semiconductor IC. [0053] One or more wire bonds 108 connect corresponding bond pads 118 on IC die 102 to contact pads or points 120 on substrate 104. [0054] An encapsulate 116, such as a mold compound, epoxy, or other encapsulating material, covers IC die 102 and wire bonds 108 for mechanical and environmental protection. [0055] As shown in FIG. 1A, flex BGA package 100 d