device including metal contact and capacitorUS20020052097May 3, 2001May 2, 2002Park Young-HoonApparatus and method for depositing thin film on wafer using atomic layer depositionUS20020055235Oct 29, 2001May 9, 2002Micron Technology, Inc.,Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layersUS20020060363Jan 17, 2002May 23, 2002Applied Materials,