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  • ductor substratesUS7334630 *25 May 200526 Feb 2008The Board Of Trustees Of The Leland Stanford Junior UniversityClosed-loop microchannel cooling systemUS735385924 Nov 20048 Apr 2008General Electric CompanyHeat sink with microchannel cooling for power devicesUS7358201 *19 Apr 200515 Apr 2008Intel CorporationMethods of forming channels on an integrated circuit die and die cooling systems including s
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