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  • device including combed bond pad opening, assemblies and methodsUS5990566 *20 mai 199823 nov. 1999Micron Technology, Inc.High density semiconductor packageUS6048753 *13 f???vr. 199811 avr. 2000Micron Technology, Inc.Standardized bonding location process and apparatusUS6078068 *15 juil. 199820 juin 2000Adaptec, Inc.Electrostatic discharge protection bus/die edge sealUS6085962 *8 sept. 199711 juil.
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