A module of the cellular phone shown in FIG. 3A includes a printed wiring board 816 over which a CPU 802 laminated on a memory 811 (regions 802/811 in FIG. 3A), a power supply circuit 803, a controller 801 laminated on a sound processing circuit 829 (regions 801/829 in FIG. 3A), a transmitter-receiver circuit 804, furthermore, elements such as a resistance, a buffer, and a capacity element are mou