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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • A method is disclosed which includes positioning a first die above a portion of a flexible material, the first die including an integrated circuit and the flexible material including at least one conductive wiring trace, and forming an encapsulant material that covers the first die and at least a portion of the flexible material, wherein at least a portion of the flexible material extends beyond t
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