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  • metallic substrate. [0049] The circuit wiring substrate of the present embodiment has been described for the case where a silica-based filler is used as the inorganic filler to be added to the molding resin, but as in the case of the inorganic filler to be added in the insulated layer, use can be made of other materials such as aluminum oxide, aluminum nitride, silicon nitride, and boron nitride,
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