prov:value
| - In one embodiment, layers 12, 16, and 20 include a dielectric or insulating material such as silicon dioxide, silicon nitride, silicon oxynitride, a high dielectric constant (???high-k???) material (e.g., dielectric constant greater than 8), or any combination thereof while layers 14 and 18 comprise a conductive material, such as a doped silicon layer, a metal, or the like.
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