nt invention, with reference to FIGS. 3 and 13.The cleaning and drying apparatus 18 has a cleaning tank 22 (cleaning chamber) which is filled with a chemical such as hydrofluoric acid and a rinse (cleaning liquid) such as distilled water, where the wafers W are immersed in this chemical andcleaning liquid; and a drying chamber 23 positioned above the cleaning tank 22.