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  • Potier, et al., ???Fluxless Soldering Under Activated Atmosphere at Ambient Pressure???, Surface Mount International Conference, 1995, San Jose, Calif., and U.S. Pat. Nos. 6,146,503, 6,089,445, 6,021,940, 6,007,637, 5,941,448, 5,858,312 and 5,722,581 describe a process for producing activated H2 (or other reducing gases, such as CH4 or NH3) using electrical discharge.
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