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  • *Oct 25, 1993Jul 19, 1994General Electric CompanyHigh density interconnect structure including a chamber* Cited by examinerReferenced byCiting PatentFiling datePublication dateApplicantTitleUS5541135 *May 30, 1995Jul 30, 1996Motorola, Inc.Method of fabricating a flip chip semiconductor device having an inductorUS5717249 *Apr 4, 1996Feb 10, 1998Matsushita Electronics CorporationRF power amplifying
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