01Bc Components Holdings B.V.Produced from molding compositions including thermoset polymers having low halide extractability, preferably based on materials such as phenolic resins, and nonporous fillersUS6197859 *Jan 30, 1998Mar 6, 2001The Bergquist CompanyThermally conductive interface pads for electronic devicesUS6197862 *Sep 11, 1996Mar 6, 2001Daikin Industries, Ltd.Granulation of a mixture of