ctrical insulated substrates 2 and 6 using adhesive 20 such as epoxy or silicone, and sandwich spiral coil patterns 11A to 11D. [0029] Coil unit 26, which is formed mentioned above, of the module component is specifically described hereinafter with reference to FIGS. 1, 2A, 2B, 2C, 3A, 3B and 3C. [0030]FIG. 2A is a front view of electrical insulated substrate 3.