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  • The insulative film substrate 122 is provided with feed holes at predetermined intervals on both edges thereof, so that the insulative film substrate 122 can be moved in its longitudinal direction. [0014] The metal wiring pattern 123 is made of a conductive material such as copper (Cu) or the like, and tin (Sn), Au, or the like is plated on a surface of the metal wiring pattern 123.
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