prov:value
| - Afterwards, the bottom surface 100 of the semiconductor wafer assembly with patterning and bonding pads 102 may be treated with tape, wax, epoxy, or other materials or a combination of materials forming a protective layer 120, as illustrated in FIGS. 11 and 11B. The protective layer 120 is typically greater than 1 ??m and may comprise a conductor (e.g., Cr/Au, Ni/Au, Ti/Au, Al/Ti/Ag/Ti, Ti/Au, Cr/
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