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  • e pick-up of the chips ((S3) step), and the die-bonding ((S4) step) were performed.The chip mounting substrate (the stacked body including the adhesive film) being die-bonded after the die-bonding was introduced into the heat compression device and heated under the static pressure larger by 0.5 MPa with respect to the ambient pressure at 50?? C. for 30 minutes to remove the voids ((IP) step).
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