The construction of thermopile 20 can vary but it typically includes thermal elements 22a and 22b, diaphragm or membrane 24 (e.g., layers of a dielectric, p-silicon, and other materials), and silicon heat sink 26 forming cold junctions 28a and 28b and hot junction 30 with absorber 32.The subject invention eliminates the TO can style package commonly used for infrared and other sensors.